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Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)
Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)
Date: 27 April 2011, 06:42

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This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging.
This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

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