Handbook of Silicon Wafer Cleaning Technology (Materials Science and Process Technology) - ISBN:0815515545

Handbook of Silicon Wafer Cleaning Technology (Materials Science and Process Technology)

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Handbook of Silicon Wafer Cleaning Technology (Materials Science and Process Technology)
By Karen A. Reinhardt, Werner Kern
* Publisher: William Andrew Publishing
* Number Of Pages: 660
* Publication Date: 2007-11-12
* ISBN-10 / ASIN: 0815515545
* ISBN-13 / EAN: 9780815515548
Product Description:
The second edition of the Handbook of Silicon Wafer Cleaning Technology is a collection of invited papers on wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow is presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. The Handbook reviews the current cleaning technologies, as well as advanced cleaning technologies under investigation for next generation processing, including supercritical fluid, laser, and cryoaerosol cleaning techniques. In addition, the theoretical aspects of the cleaning technologies and how these processes affect the wafer are discussed, including device damage and surface roughening. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included.
• Focused on silicon wafer cleaning techniques including wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits.
• As this book covers the major technologies for removing contaminants, it is a reliable reference for anyone that manufactures integrated circuits, or supplies the semiconductor and microelectronics industries.
• Covers processes and equipment, as well as new materials and changesrequired for the surface conditioning process.
• Editors are two of the top names in the field and are both extensively published.
• Discusses next generation processing techniques including supercritical fluid, laser, and cryoaerosol.
Table of Contents
Part 1: Introduction and Overview
1. Overview and Evolution of Silicon Wafer Cleaning Technology
2. Overview of Wafer Contamination and Defectivity
Part 2: Wet-Chemical Processes
3. Particle Deposition and Adhesion
4. Aqueous Cleaning and Surface Conditioning Processes
Part 3: Dry Cleaning Processes
5. Gas-phase Wafer Cleaning Technology
6. Plasma Stripping and Cleaning
7. Cryogenic Aerosols and Supercritical Fluid Cleaning
Part 4: Analytical and Control Aspects
8. Detection and Measurement of Particulate Contaminants
9. Surface Chemical Composition and Morphology
10. Ultratrace Impurity and Surface Morphology Analysis
11. Analysis and Control of Electrically Active Contaminants
Part 5: Directions for the Near Future

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