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Area Array Packaging Handbook: Manufacturing and Assembly
Area Array Packaging Handbook: Manufacturing and Assembly
Date: 23 May 2011, 19:35

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Product Description: *Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)

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