The Electronic Packaging Handbook (The Electrical Engineers Handbook Series) | Date: 06 May 2011, 20:09
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The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Review
highly recommendedenough detailprovides essential factural information on the design, manufacturing, and testing of electronic devices and systemsthis book is primarily for engineers and technicians involved in any aspect of design, production, testing, or packaging of electronic productsThe book ties together well with references between chapterswell written and editedeach chapter includes a section of bibliographic references and suggested readings.
--Dave Fish, Pandion Electronics, Inc., SMTnet.com
Contents
1 Fundamentals of the Design Process
2 Surface Mount Technology
3 Integrated Circuit Packages
4 Direct Chip Attach
5 Circuit Boards
6 EMC and Printed Circuit Board Design
7 Hybrid Assemblies
8 Interconnects
9 Design for Test
10 Adhesive and Its Application
11 Thermal Management
12 Testing
13 Inspection
14 Package/Enclosure
15 Electronics Package Reliability and Failure Analysis: A Micromechanics-Based Approach
16 Product Safety and Third-Party Certification
Appendix A: Definitions
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