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Solder Joint Technology - Materials, Properties, and Reliability
Solder Joint Technology - Materials, Properties, and Reliability
Date: 14 April 2011, 00:08

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The trend in consumer electronic products will be more and more wireless, portable, and handheld. To manufacture these multifunctional products, highdensity circuit interconnections between a Si chip and its substrate are needed. Flip chip solder joint technology, by which an area array of solder bumps is used to join a chip to its substrate, is growing rapidly in demand. Flip chip technology is the only technology that can provide a large number of such interconnections with reliability. Solder joints are ubiquitous in electronic products.

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