Electronic Materials and Processes Handbook | Date: 30 April 2011, 10:02
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Electronic materials are the actual semiconductors, plastics, metals and ceramics that make up the chips and packages from which we construct today's cell phones, palmtops, and PDAs. The switch in applications from PCs to smaller communications devices has driven the micro-miniaturization trend in electronics, which in turn has created a new set of challenges in creating materials to meet their specifications... This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and micro-miniature sizes. This new handbook will be an invaluable tool to anyone working electronic packaging, fabrication, or assembly design...
MICROMINIATURIZATION EXPLAINED IN A BIG WAY!
The rise of cellular phones, PDAs, and palmtops has brought with it a host of new challenges for those charged with creating materials to meet those devices' specifications. And now, thanks to McGraw-Hill's Electronic Materials Handbook, engineers have comprehensive coverage of the materials that cater to the microminiaturization trend in electronics.
Written by a team of experts from around the globe, this indispensable volume reflects the importance of engineering materials for thermal management system optimization and flexibility in microminiature sizes. It offers detailed discussions of a complete range of pertinent topics, including:
* Full material breakdowns for high-density packaging techniques
* Materials for communications wiring and cabling
* And much, much, more!
So, no matter if your work includes electronic packaging, fabrication, or assembly design, Electronic Materials Handbook will help you master the growing demands of microminiaturization.
Inside you'll find:
Basic Materials and Processes
* Semiconductors
* Plastics, Elastomers, and Composites
* Ceramics, Glasses, and Diamonds
* Metals
* And more!
Materials Systems
* Circuit Board Processing
* Hybrid Microelectronic Materials and Systems
* Optoelectronic Materials and Systems
* Encapsulants, Underfills, and Molding Compounds for
* High-Density Packaging
* And more!
Review
The electronics industry has seen an ever-increasing number of new materials, manufacturing methods, and packaging concepts for producing a constant stream of new and amazing products such as digital cameras, DVD camcorders, DVD burners, PC, PDA, GPS, wireless communications, etc. The list can keep going. And what is really amazing is that all of these devices are constantly being developed to improve performance, decrease size, and lower cost. The creative and ingenious ideas would not be possible without the continuous research and development of new materials and fabrication techniques used in the electronics industry. For example, the discovery and development of new materials (low-k dielectrics and SiC)enables higher speed and higher temperature electronics. Conductive plastic composites are used for RFI/EMI shielding and other types of inherently conductive plastics are used in chemical sensing. New coatings protect PC boards, and new deposition processes and multilayer board layouts and board materials allow for a much higher packing density, resulting in very small packages. New materials and layouts are also used for increasing the thermal capacity of devices. . .
This third edition, reflecting recent dramatic changes that have occurred since the previous edition, is broken down into three main parts. The first set of chapters covers materials critical to electronics, including semiconductors, plastics, elastomers, composites, glasses, ceramics, and various metals. The following set of chapters describes materials and interconnection processes. These include circuit board and processing, metallic coatings, electroplating, adhesives, underfills, and coatings for assemblies. The final chapter describes packaging materials for thermal management and factors determining thermal resistance.. .
Each chapter is loaded with practical graphs, illustrations, photographs, and information written by experts in the field and would be useful to materials scientists, engineers, and anyone who needs up-to-date information on materials and processes critical to the electronics industry. . (IEEE Electrical Insulation Magazine )
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